抄録
We have demonstrated systematic studies of plasma-induced copper nanoparticle deposition onto a poly(4-vinylpyridine)-grafted-poly(tetrafluoroethylene) surface, as well as their autocatalytic characteristics for the initiation of the following electroless copper plating. The plasma-induced reduction of the organo-copper precursor gradually increased the surface copper concentration owing to the formation of the copper nanoparticles with treatment time. The concentration became maximal at 300 s of treatment, and then it progressively decreased with further plasma treatment. XPS, SEM, and AFM experiments revealed that the total population of nanoparticles on the surface was clearly decreased, while the particles continued to grow. We found that thermodynamically driven spontaneous migration of Cu atoms occurred from the initially formed smaller particles to the larger ones, by the Ostwald ripening mechanism. The polymer surface densely and homogeneously seeded with copper nanoparticles enable the initiation of autocatalytic electroless deposition of copper layer at 40℃ with less than 5 s time lag.
