2013 年 38 巻 1 号 p. 37-40
This work employs double patterning and Ni salicides processes in the fabrication of polycrystalline silicon (poly-Si) thin-film transistors (TFTs) and studies the radio frequency (RF) performance of the fabricated devices. The fabricated TFTs show a high on-to-off current ratio (Ion/Ioff) of 1.78 × 107 and a high current drive of around 200 μA/μm. The cutoff frequency, ƒt, and maximum frequency of oscillation, ƒmax exceeds 8 and 11 GHz, respectively, biased at a low-operating drain voltage of 2 V. The equivalent-circuit models are also derived and characterized with both the measured and simulated S-parameters. These results demonstrate that the poly-Si TFT technique is promising for RF module implemented in the system-on-panel applications.