抄録
We report a technique of direct patterning of Cu thin films on Pd nanoparticles photodeposited on layer-by-layer (LbL) films consisting of sodium polystyrene sulfonate (PSS) and TiO2 nanoparticles on plastic sheets. The LbL films were formed on plastic sheets by soaking the plastic sheets alternately in PSS acidic solution and TiO2 nanoparticle dispersion. The amounts of PSS and TiO2 nanoparticles in the LbL films were proportional to the number of immersion. Pd nanoparticles were formed on the PSS/TiO2 LbL films by irradiation with UV light through metal masks in acidic solution of palladium chloride. The amount of the Pd nanoparticles increased with increasing UV irradiation time. Cu films were deposited selectively on the Pd nanoparticles in the electroless plating bath of Cu. The results of the energy dispersive X-ray analysis and the elemental mapping were consistent with the above results. With an increase in the layer number of the LbL films, the growth rate of Cu films increased probably due to an increase in the amount of Pd nanoparticles on the LbL films. This technique allows for the reduced material consumption and fabrication steps in direct metal patterning on plastic sheets using light irradiation.
