2017 年 E100.A 巻 7 号 p. 1488-1495
Shrinking feature sizes and higher levels of integration in semiconductor device manufacturing technologies are increasingly causing the gap between defect levels estimated in the design stage and reported ones for fabricated devices. In this paper, we propose a unified weighted fault coverage approach that includes both bridge and open faults, considering the critical area as the incident rate of each fault. We then propose a test pattern reordering scheme that incorporates our weighted fault coverage with an aim to reduce test costs. Here we apply a greedy algorithm to reorder test patterns generated by the bridge and stuck-at automatic test pattern generator (ATPG), evaluating the relationship between the number of patterns and the weighted fault coverage. Experimental results show that by applying this reordering scheme, the number of test patterns was reduced, on average, by approximately 50%. Our results also indicate that relaxing coverage constraints can drastically reduce test pattern set sizes to a level comparable to traditional 100% coverage stuck-at pattern sets, while targeting the majority of bridge faults and keeping the defect level to no more than 10 defective parts per milion (DPPM) with a 99% manufacturing yield.
