マイクロプロセッサのダイ周りの非定常熱伝導シミュレーション

抄録

This paper explains about fundamental formula of calculating power consumption of CMOS (Complementary Metal-Oxide-Semiconductor) devices and its voltage and temperature dependency, then introduces equation for estimating power consumption of the microprocessor for notebook PC (Personal Computer). The equation is applied to heat conduction simulation with simplified thermal model and evaluates in sub-millisecond time step calculation. In addition, the microprocessor has two major heat conduction paths; one is from the top of the silicon die via thermal solution and the other is from package substrate and pins via PGA (Pin Grid Array) socket. Even though the dominant factor of heat conduction is the former path, the latter path - from package substrate and pins - plays an important role in transient heat conduction behavior. Therefore, this paper tries to focus the path from package substrate and pins, and to investigate more accurate method of estimating heat conduction paths of the microprocessor. Also, cooling performance expression of heatsink fan is one of key points to assure result with practical accuracy, while finer expression requires more computation resources which results in longer computation time. Then, this paper discusses the expression to minimize computation workload with a practical accuracy of the result.