1P1-12 フレキシブル電極パターンのガラス基板上への超音波ボンディングと諸条件の影響(ポスターセッション)

抄録

The purpose of this paper is to find bonding parameters of electrodes between the glass and flexible printed circuit board (FPCB) using ultrasonic vibration. The electrodes of FPCB and were electroless-plated with Sn and the glass substrate was sputtered with Cu. The peel strengths of the joints were investigated with various parameters, such as bonding pressure and time. This study showed that the electrodes between the glass and FPCB were successfully bonded without any adhesive at a low temperature during a short time, compared to other bonding methods: adhesive bonding and thermo-compression bonding.