抄録
The present paper describes the residual stress and deformation due to thermoviscoelastic behavior of materials and non-uniformity temperature in the cooling process during its molding.
The viscoelastic model including an element for thermal expansion is proposed in order to express the viscoelastic behavior of material with temperature change. Using this model, a qualitative prediction of the residual stress and deformation of cooled viscoelastic material is done.
Using the linear-viscoelastic theory, fundamental equations for the residual stress and deformation of a viscoelastic strip, where an unsteady and non-uniformity temperature distribution is assumed in the direction of thickness, are shown. The theoretical values of residual stress and deformation of the strip which is made by epoxy resin are calculated under various temperature conditions.
Finally, epoxy resin strips are actually cooled, and the residual stress and deformation of strips is measured. The experimental results are compared with the theoretical ones and the relationship between the residual stress or deformation and thermoviscoelastic behavior are quantitatively explained.
