抄録
Copper clad laminates, widely used as raw materials of printed circuit boards for TVs and VTRs, are required the low warp during the production process of circuit boards due to automated process.
A numerical simulation method of the warp for the copper clad laminates are explained during the heating and cooling process. A thermoviscoelastic model with either zero or infinite viscosity is proposed to simulate the bechavior of the resin material and the laminated beam theory is applied to express the warp of the laminates.
The theoretical results of the warp show almost good agreement with the experimental results during the soldering process, where the warp becomes largest among the whole production processes. By analyzing the calculated results, the dominant factors of the warp are clarified and the effects of the thermoviscoelastic becavior are quantitatively determined.
