In order to further elucidate the mechanism of pitting corrosion of copper, laboratory reproduction of pitting was carried out in test loops simulating a hot-water supply system in buildings. In hot water containing 3mg/
l residual chlorine and 35mg/
l SiO
2, the electrode potential of copper exceeded the critical value for pitting (150mV vs SCE) in relatively early stages (in 15 days). In this case, the dissolved silicate concentration was adjusted by adding sodium metasilicate. Pits reproduced in the test loops showed the same features as those found in actual service line. The inner layer of the corrosion products consisted of cupric oxide (CuO) and cupric metasilicate (CuSiO
3·H
2O), while the outer layer was covered with porous amorphous copper silicate. The formation of silicate film is responsible for the acceleration of chlorine reduction on the cathode sites and consequently the nobler electrode potential. Experiments were carried out in hot water with residual chlorine concentration adjusted to 0.7mg/
l, the level of normal Japanese drinking water. Even in this water the electrode potential of copper exceeded the critical value for pitting in 120 to 150 days and pits were visually observed to occur. Dissolved SiO
2 content was 15 to 20mg/
l without the addition of sodium metasilicate. The addition of sodium hexametaphosphate of 15mg/
l (P
2O
5) to hot water containing residual chlorine of 3mg/
l suppressed both the potential ennoblement and pit formation on copper tubes. In this case, the inner layer of film consisted of cuprous oxide (Cu
2O) on which a layer was uniformly covered with the amorphous deposits consisting of copper, oxygen and phosphorus. Electrochemical polarization experiments showed poor catalytic property for the cathodic reduction of chlorine on surfaces covered with phosphate containing film.
抄録全体を表示