A novel micro immunoassay chip for detecting biomarkers in blood plasma has been developed by using an injector-based antibody immobilization. Since multiple detectors were made in a single channel, the chip was able to detect various biomarkers simultaneously. UV Laser processing of the substrate was performed to enhance immobilization of the antibody. In P1CP, which is a biomarker for osteoporosis, this simple plastic chip requires only 1 micro liter per lane of blood plasma and 30 min of reaction time, one twentieth the sample volume required for the ELISA-kit and six times the through put.

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  In welding of 950 MPa-class high tensile strength steel, preheating is crucial in order to avoid cold cracks, which, however, eventually increases welding deformations. One way to decrease welding deformations is lowering preheating temperature by using under-matched weld metal. Toyota and others clarify that although breaking elongation can decrease due to plastic constraint effect under certain conditions, static tensile of under-matched weld joints is comparable to that of base metal. However, there has still been no report about joint static tensile of under-matched weld joints applied to 950 MPa-class high tensile strength steel. In this study, we aim to research tensile strength and fatigue strength of under-matched weld joints applied to 950 MPa-class high tensile steel.

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  Soldering is a candidate technique for joining metallic glasses. It can be processed far below the crystallization temperatures of the various metallic glasses so that there is no possibility of crystallization. However, wettability of Cu-Zr based metallic glass by Pb free solder is poor because a strong surface oxide film interferes direct contact between them. To overcome the problem, Cu thin film clad metallic glass was developed. It was preliminary produced by casting a melt of Cu₃₆Zr₄₈Al₈Ag₈ pre-alloy into Cu mold cavity, inside which Cu thin film with 2 mm in thickness was set on the wall. Cu₃₆Zr₄₈Al₈Ag₈ metallic glass, whose surface Cu thin film was welded to, was successfully produced. From the microstructure analyses, it was found that reaction layer was formed at the interface between Cu and Cu₃₆Zr₄₈Al₈Ag₈ metallic glass, however, there was no oxide in the Cu clad layer. Solderability to the metallic glass was drastically increased. The Cu clad layer played an important role to prevent the formation of surface oxide film and consequently improved the solderability.

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