The study of the cutting phenomenon by visualization of orthogonal cutting behavior
Released on J-STAGE: August 11, 2006 | Volume 49 Issue 1 Pages 24-29
Takuya TAKESHIMA, Noboru MORITA, Shigeru YAMADA, Noboru TAKANO, Tatsuo OYAMA
The impact of wafer edge profile on polishing performance in silicon wafer manufacturing
Released on J-STAGE: July 09, 2010 | Volume 53 Issue 2 Pages 105-110
Akira FUKUDA, Tetsuo FUKUDA, Hirokuni HIYAMA, Manabu TSUJIMURA, Toshiro DOI, Syuhei KUROKAWA
Development of high-efficient CMP process of SiC wafers for power electronics
Released on J-STAGE: November 25, 2016 | Volume 60 Issue 8 Pages 454-459
Shinya HIRANO, Kenji KAWATA, Hirokuni ASAMIZU, Tomohisa KATO
Effect of various groove patterns on slurry flow in polishing pads
Released on J-STAGE: April 08, 2013 | Volume 56 Issue 6 Pages 388-394
Tsutomu YAMAZAKI, Toshiro DOI, Michio UNEDA, Syuhei KUROKAWA, Osamu OHNISHI, Kiyoshi SESHIMO, Hideo AIDA
Machining of difficult-to-machine materials by PVD coated tools
Released on J-STAGE: April 22, 2014 | Volume 57 Issue 8 Pages 536-541
Koji SHIMAMURA, Akira HOSOKAWA, Kosuke IBE, Takashi UEDA, Seiichi MASA
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