A basic combination of dicyandiamide (DICY) as a latent curing agent and 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DCMU) as a curing accelerator was used for a general-purpose bifunctional epoxy resin, diglycidyl ether bisphenol A (DGEBA). In this study, the composition of DGEBA/DICY/DCMU was fixed, and only the reaction pathway was changed during curing to investigate the difference in the reaction mechanism and the resulting difference in the crosslinked structure and mechanical/thermal properties. In addition, the activation energies and heat of formation of multiple reactions that govern the curing reaction were investigated using quantum chemistry calculations. As a result, glass transition temperature (Tg) decreased by 10 °C as the dwell cure temperature increased. Young’s modulus increased with curing temperature, although there was no major difference in strength, strain to failure and strain energy. These results suggest that the reaction mechanism differs depending on the dwell cure temperature. FT-IR measurement revealed that in case of lower dwell temperature (100 °C), many cyano groups remain before gelation, due to less dissolvement of DICY. Consequently, anionic polymerization of epoxy mainly occurs because of dimethylamine generated by pyrolysis of DCMU. On the other hand, at a higher dwell cure temperature (160 °C), the cyano group peak decreases and the acid amide peak increases. Consequently, not only anionic polymerization but also the chain structure due to the epoxy-DICY reaction increases, indicating changes in the degree of branching of the initially formed microgels. At 160 °C dwell, more oxazolidinone (1760 cm-1) was produced before gelation compared to low temperature dwell, and some epoxy groups were terminated before microgel formation. It is considered that the connection between microgels progresses and a relatively dense cross-link structure is formed. On the other hand, at low temperature dwell, epoxy group termination by oxazolidinone occurs even after microgel formation, which suppresses network formation between microgels.
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