An amphiphilic aryl-ether AB₂-type dendron（1）bearing oligo ethylene glycol（OEG）chains exhibited lower critical solution temperature behavior in aqueous solutions. In the presence of the salting-out salts（Na₂SO₄, NaCl, and NaBr）, the cloud points of 1 decreased linearly with increasing salt concentration. The slope of the linear decrease changed with the anion type in the order, SO₄^2－ > Cl^－ > Br^－. In the presence of the salting-in salts（NaSCN and NaI）, the cloud points of 1 increased non linearly with increasing salt concentration. The shape of these curves can be well fitted by adding a Langmuir binding isotherm to the linear term used for the salting-out salts. When monohydric alcohols（ethanol and 1-propanol）were added to the aqueous solutions of 1, the cloud points barely changed but were reduced after adding polyhydric alcohols（ethylene glycol, xylitol, and D-sorbitol）. The salt effect on the cloud points of 1 was negligible in the aqueous polyhydric alcohol solutions. Conversely, the addition of monohydric alcohols to the aqueous solutions could amplify the salt effect on the cloud points. The alkyl groups of monohydric alcohols could be hydrated by water molecules accompanied by the formation of a hydration shell with a clathrate-like structure. Hence, free water molecules are consumed by adding monohydric alcohols to the aqueous solutions. Overall, the amplifi cation of the salt eff ect on the clouding points of 1 could be deduced by increasing the salt concentration around 1.

The soundness of the edge of the round hole made in the aluminum fl at plate is confi rmed by using the second harmonic of Lamb wave. To efficiently generate Lamb waves in S0 mode and detect second harmonic Lamb waves, from the velocity dispersion curve of Lamb waves, we created a probe using a wedge that has an appropriate critical angle. As a result of the experiment, the second harmonic increases because the peripheral part of the hole is plastically deformed by making a round hole. On the other hand, in the case of the peripheral part of the hole is scratched, the second harmonic is scattered. The amount of second harmonic components detection would decrease was discussed

High saturation magnetization, perpendicular magnetic anisotropy, and high Curie temperature are required for ferromagnetic/ferroelectric thin films to apply the Race-Track memory, which are next-generation magnetic recording devices. Therefore, in the BiFeO₃-based ferromagnetic/ferroelectric thin fi lms, the amount of substituted La for Bi in the A-site was fi xed at about 50 at%, and the amount of substituted Ni or Co for Fe in the B-site was varied from 0 to 35 at%, respectively. The magnetic properties of（Bi,La）（Fe,Ni）O₃ and（Bi,La）（Fe,Co）O₃ films were investigated and compared. As a result, the thin fi lms with Ni substitution of 30 at% and Co substitution of 28 at% showed the best magnetic properties, and the maximum saturation magnetization was 78 emu/cm³ in the thin film with Co substitution. Normalized coercive force of perpendicular to the film plane by coercive force of parallel to the fi lm plane（perpendicular magnetic anisotropy）and the Curie temperature were 4.1 and more than 475°C, respectively in the thin fi lm with Ni substitution.

The correction polishing using a small tool is expected to be a technology for achieving highly effi cient polishing of semiconductor wafers. However, in correction polishing, high-precision control of the polishing pressure is required to prevent excessive removal in the planarization. Therefore, we have started to develop a new polishing load control system using an electric actuators. Furthermore, we have attempted to enhance a polishing removal amount using the electric slurry control technique. As the result, it was found that the variation of the removal amount decreased by 1/4 compared to the conventional load control system. Furthermore, the polishing removal amount was increased by 45 % at applied voltage 4kV. Therefore, we clarifi ed that the proposed polishing technology has the capability to obtain the high precision and rapid polishing.