ニッケルめっきにおける塩化物イオンの役割

抄録

The role of chloride ion in the plating of nickel has been studied by using a special electrolytic cell which permits continuous measurement of the amount of hydrogen evolved during electrodeposition. It was found that an increase in the concentration of chloride ion accelerated the deposition of nickel and inhibited the co-evolution of hydrogen, and these effects of chloride were especially remarkable at high pH values. The kinetic parameters for the electrodeposition of nickel were fully explained by a kinetic equation derived by assuming a chloride-containing adsorbed intermediate. It is considered highly probable that the number of effective sites for hydrogen evolution is reduced by adsorption of the reaction intermediate during the electrodeposition of nickel