1998 年 49 巻 8 号 p. 900-904
The origin of inductive behavior in electrochemical impedance during metal deposition was discussed based on numerical analysis. Impedance was calculated by the modulation of adsorption coverage Δθ/ΔE as follows: 1/Z=AF+jωCdl, AF=aA1+aA2 Δθ/ΔE, Δθ/ΔE=aθ1(jωaθ2+1), where AF is admittance, Cdl capacitance of electric double layer, ω angular frequency, and ai constant. Results of calculation indicate that the following adsorption processes are related to inductive behavior in metal deposition: (i) adsorbed intermediate in consecutive reaction, (ii) cathodic adsorbed species as catalyst, and (iii) anodic adsorbed inhibitor.