Features of dissimilar materials bonding are surface bonding and several type of adhesives can be used. Bycontrolling thermal expansion coefficient of an adhesive to get middle of dissimilar materials, residual stresscan be reduced, in case of internal stress caused by thermal movement the difference of thermal expansioncoefficient between a metal and a plastic．Also it is possible to reduce a stress which is caused by thermalmovement, by adjusting the elastic modulus of adhesive. We introduce structural and elastic adhesives usedfor dissimilar materials bonding and their characteristics and applications. We also would like to introduce ourSTPE base adhesives which newly developed for the purpose of dissimilar materials bonding. It is known that asea-island structure can be obtained by curing a STPE and an epoxy resin in mixture. The sea-island structureis that the epoxy resin is dispersed in the elastic matrix of STPE. New polymers which shows high strength,toughness and durability has been being developed as a sea matrix by blending and hybridization STPE andacrylic resin having silyl group. The development goals of the adhesive are 15-20MPa strength and more than100% of elongation. And also the curing trigger will be UV, not heating. UV cure can provide very fast cureand on-demand cure which is stably uncured until UV irradiation. We believe that our new technology couldprovide non-heating for application and curing of adhesive in production line in the future.
