解説22.各種接着剤の基礎と進展
(11) 環境調和型シリコーン接着剤の開発
2021 年 57 巻 3 号 p. 119-127
詳細
2021 年 57 巻 3 号 p. 119-127
The electronics industry has expanded its application area to all industries such as OA, FA, and automotive, and is growing into an important basic industry. This growth is due to continuous technological innovations such as high-density of hybrid ICs, innovated materials and new functional materials. Furthermore, it is necessary to consider strengthening regulated substances for the environment and energy saving measures recently. Silicone materials have excellent reliability and electrical properties and is used as a functional material in this area. In order for silicone adhesive to fit Green Chemistry, we are considering to avoid regulated substance such as tin based compound and energy saving due to cure condition continuously. Momentive silicones’ TN series which is one component fast moisture cure adhesives, has achieved tin-free while maintaining the same performance as the conventional TSE39x series. Also, new addition cure adhesives concept is not to require heat cure process. Conventional one component and two component addition cure adhesives TSE32x series and TSE33xx series are required >100 degC for adhesion, while new concept adhesives achieved to lower temp cure condition（<50degC or room temperature）for excellent adhesion.
