Instantaneous Solder Joining Technique Using Exothermic Reaction of Al/Ni Multilayer Powder

抄録

Since an Al/Ni multilayer powder developed by a repetitive cold rolling and pulverizing method shows controllable instantaneous self-propagating exothermic reaction, it is expected that the Al/Ni multilayer powder can be used as a heat source for the solder joining procedure. To evaluate the validity of the instantaneous solder joining technique using the exothermic heat, solder joining experiments using Cu wire specimens were performed. Based on the experimental results, we investigated an influence of an additional amount of the Al/Ni multilayer powder on the electrical and mechanical properties of the solder joining part. As a result, in the limited optimum amount of the Al/Ni multilayer powder, we successfully obtained the expected solder joining parts involving relatively lower electrical resistance and higher strength. In contrast, the fracture strength decreases with increasing the additional amount of the Al/Ni multilayer powder caused by a generation of lots of huge voids in the solder layer due to overheating. In summary, it is likely that the instantaneous solder joining technique using the Al/Ni multilayer powder enable us to be utilized by the optimum additional amount of the Al/Ni multilayer powder.