抄録
Kenaf has less cellulose and lignin and more hemi-cellulose. Therefore, a board can be built only with a kenaf. Moreover, kenaf may contribute toward the reduction of green house gases. Nowadays, chemical sensitivity has been a problem with the volatile organic compound (VOC) emitted from building materials. This problem may be solved by using an inorganic compound for the adhesives of building materials. This research aims at development of kenaf board using the sodium silicate solution which is an inorganic compound as adhesives and examination of the bending strength of the proposed kenaf board. Consequently, it is clarified that the influence of the water content and the additional ratio of adhesives on the bending strength of the kenaf board.
