2025 年 14 巻 1 号 p. 5-7
In this paper, we report the results of reflection imaging of silicon wafers using terahertz waves, aiming to achieve both high resolution and transparency in sensing technology. We compare the theoretical calculations of the transmittance of silicon wafers with the experimental results obtained through imaging. Through this study, we were able to confirm the frequency characteristics of silicon wafers using terahertz reflection imaging.