抄録
This paper presents how bonding condition between asphalt pavement layer can be predicted by comparing pavement moduli from measured deflection by FWD test and computed deflection from structural analysis through backcalculation process. The structural analysis which involved varies bonding condition was carried out by BISAR software using Shear Spring Compliance and the other hand the backcalculation process was carried out by ELMOD5 software using four layer pavement model with varies bonding condition. The results indicate that the shear modulus prediction can be conclude from minimum differences between both of kind of pavement moduli. Beside that the measured deflection for pavement which have good bonding are located between computed deflection which have partial bonding condition. Better bonding condition at the interface between layers will cause the decreasing of pavement deflection, as the results the better structural capacity can be achieved with better bonding between layers.
