Abstract
In order to comply with the EU RoHS directive scheduled in July 2006, we've developed the new solder evaluation technique for the printed-circuit board unit. This is non-destructive technique based on x-ray fluorescence mapping analysis, determines if lead contained in the solder excesses over allowable limits. Although the printed-circuit board unit consists of various materials, using this technique, we can discriminate between the unacceptable material containing lead such as solder, and the acceptable materials containing lead such as glass and electronic ceramics, by seeking the overlaps with the coexisting element's distribution. Fujitsu started to check the purchased printed-circuit board units with this solder evaluation system.
