Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17B-08
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Host: Japan Institute of Electronics Packaging

New Multi-Layer FPC "SBic" for high-density packaging 2
*Makoto Inaba, Toshio Komiyatani, Toshiaki Chuma, Mikihiko Ishibashi, Masayoshi Kondo, Takahisa Iida
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Keywords: Multi-Layer, FPC, Bump Interconnection, Solder Interconnection
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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