Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17B-09
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Host: Japan Institute of Electronics Packaging

Polyimide Multi-Layer Printed Circuit Board with Alloying Paste
*Masahiro Okamoto, Shouji Itou, Kunihiko Inoue, Takaharu Hondo, Shouichi Takenaka, Naoyuki Ozawa
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Keywords: Single batch press, Conductive paste, Polyimide
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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