Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 16A-07
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Host: Japan Institute of Electronics Packaging

Low cycle fatigue damage of micro-bulk solder alloys
*Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga, Masahisa Otsuka
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Keywords: fatigue, solder, lead free solder, micro bulk, mechanical properties
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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