Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 16A-08
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Host: Japan Institute of Electronics Packaging

Consideration of real operation goods and heat cycle test seen from solder
*Wataru Urano, Masaru Mogi
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Keywords: solder, Reliability, heat cycle test
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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