Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17B-13
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Host: Japan Institute of Electronics Packaging

Effect of palladium free catalyst process on surface morphology of electroless nickel plating
*Takanori Tsunoda, Hiroki Nagasima, Hideto Watanabe, Hideo Honma
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Keywords: electroless nickel plating, catalyst process, Dimethylamine-borane
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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