Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17B-14
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Host: Japan Institute of Electronics Packaging

Metalizetion on Smooth Curcuit Substrate without etching using Photo Catalyst
*Koutoku Inoue, Kumiko Ishikawa, Tubasa Fujimura, Takehiko Tashiro, Makoto Hayashi, Hideo Honma
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Keywords: Photo Catalyst, UV, Smooth Curcuit Substrate, Electroless Cupper Plating
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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