Abstract
The debates have now developed to the extent that a movement to establish regulations for the removal of Pb has emerged, in view of environmental problems. Therefore, many studies are being undertaken to develop technologies for replacing Sn-Pb solder with a lead-free alternative. However, the problem is that voids are easily formed in lead-free solder joints during the reflow process, and the effects of void formation on the fatigue strength of solder joints have attracted attention. In this study, the relationship between formation of voids and fatigue fracture mode and fatigue strength of solder joints was examined using FEM (finite element method) analysis and mechanical shear fatigue test.
