The 19th JIEP Annual Meeting
Session ID : 18A-07
Conference information
Host: Japan Institute of Electronics Packaging
Study of wiring structures using non-cyan Ag electrical deposition for high-speed signal tansmission
Junya Tanaka, *Kazuhiko Tokoro, Katsuya Kikuchi, Hiroshi Nakagawa, Kazuo Kondo, Masahiro Aoyagi
Author information
Details
