Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18A-06
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Host: Japan Institute of Electronics Packaging

Solder joint strength of novel cyanide free displacement type electroless gold plated film without pitting corrosion
*Akihiro Aiba, Kazumi Kawamura, Masashi Kumagai
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Keywords: electroless gold plating, cyanide free, pitting corrosion
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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