Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18A-12
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Host: Japan Institute of Electronics Packaging

New Material for Buildup "Additive Prepreg"
*Tomoaki Watanabe, Yasuo Fukuhara, keiko Kashihara, Kenji Ogasawara
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Keywords: additive, Fine pattern, Prepreg, Process
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Abstract
Today, the IC tends requires the high density interconnect structures. Our new Prepreg "Additive Prepreg R05A0" is one of the best solution for those issues. The material consists of the modified epoxy resin and following characteristics, 1) Excellent processability 2)Halogenated free material, 3)Corresponding to UL 94V-0, 4) Stored at room temperature over 3 months.
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© 2005 by The Japan Institute of Electronics Packaging
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