Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18A-13
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Host: Japan Institute of Electronics Packaging

Low Elastic Modulus Epoxy Compound using styrene-butadiene rubber particles
*Takashi Nishioka, Shin-ichiro Iwanaga
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Keywords: Insulation material, Low elastic modulas
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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