Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18A-14
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Host: Japan Institute of Electronics Packaging

Development of new epoxy resin hardners for low water absorption and low dissipation factor
*Koichi Fujimoto, Masakazu Yoshizawa
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Keywords: epoxy resin, hardner, water absorption, dissipation factor
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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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