Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18B-03
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Host: Japan Institute of Electronics Packaging

Development of fine-pitch COF technology using Au-Sn joints
*naoya sato, hiroyuki ishikawa, takahiro imai, akihito narita, kazuyoshi noake
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Keywords: Au-Sn joints, COF, fine-pitch
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Abstract
We developed fine-pitch COF joint technology by Au-Sn joints.As a result, it was confirmed that an excellent Au-Sn alloy was formed with the selection of the best temperature of the bonding tool.Moreover,it was confirmed to correspond to the fine-pitch connection by using the circuit board of the best material.
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© 2005 by The Japan Institute of Electronics Packaging
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