Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18B-04
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Host: Japan Institute of Electronics Packaging

Socket for new semiconductor package with super-elasticity microring
*Hiroshi Ikeda, Shigeyuki Hoshikawa
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Keywords: Micro Ring, package, Socket
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2005 by The Japan Institute of Electronics Packaging
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