Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18B-11
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Passive Capacitor Formation Technology Using Semiconducutor Process -No.1-
*Ichiro KoiwaKinya AshikagaMakoto TeruiYasushi ShiraishiNoritaka AnzaiTakashi OhsumiTetsuya OsakaTomoya KumagaiYoshimi SatoAkira Hashimoto
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Recentry, many electronic devices have been used as an mobile tools. Therefore, both downsizing and iincreasing mounted electric element to improve are strongly required. Too many passive element limits above demand by decreasing mounteing area. To solve this problem, embedded passive elements are proposed especially for capasitor. In this papaer, a thin film capasitor for embedded is manufactured by using semiconductor porocess technology and good characteristics is obtained.
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© 2005 by The Japan Institute of Electronics Packaging
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