Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 18B-12
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Host: Japan Institute of Electronics Packaging

Making of thin film capacitor passive components that uses semiconductor .No2.
*Mitsuhiro Watanabe, Ichiro Koiwa, Kinya Ashikaga, Makoto Terui, Yasushi Shiraisi, Noritaka Anzai, Takuji Oosumi, Tetsuya Oosaka, Hideo Honma, Tomoya Kumagai, Yoshimi Sato, Akira Hashimoto
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Keywords: semiconductor technology, capacitor chip, mounting, embedded
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Abstract
We made the capacitor chip by using the semiconductor processing technology. In this report, we report on the result of mounting on the print circuit board and the result of burying this chip in the print circuit board.
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© 2005 by The Japan Institute of Electronics Packaging
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