The 19th JIEP Annual Meeting
Session ID : 17A-06
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Host: Japan Institute of Electronics Packaging
Factual Database on Creep and Creep Fatigue Properties of Sn-37Pb and Sn-3.5Ag Solders
*Akira Ueno, Masao Sakane, Takaei Yamamoto, Noritake Hiyoshi, Haruo Nose, Takamoto Itoh
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