Proceedings of JIEP Annual Meeting
The 19th JIEP Annual Meeting
Session ID : 17A-09
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Host: Japan Institute of Electronics Packaging

Reliability of Lead Free Solder Joints in Ball-Grid-Array-Type Packages under Impact Load
*Kenichi Yamamoto, Haruo Akahoshi, Hiroshi Nakano, Toshinori Kawamura, Masahiro Koizumi, Ryosuke Kimoto
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Keywords: Lead Free Solder, BGA, Reliability
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Abstract
Reliability of BGA type packages jointed with Sn-Ag-Cu solder (lead free) are investigated under impact load. It found out that the strength to impact differed greatly by the kind of solder mask material of the interposer board of BGA.
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© 2005 by The Japan Institute of Electronics Packaging
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