Proceedings of JIEP Annual Meeting
The 17th JIEP Annual Meeting
Session ID : 13A-12
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Host: japan institute of electronics packaging

Development of high thermal conduction metal base substrate with 8W/mK
*Katsunori Yashima, Naomi Yonemura, Kazuo Katoh, Yoshihiko Okajima
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[in Japanese]
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© 2003 by The Japan Institute of Electronics Packaging
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