Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-10
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Reliability Evaluation of the Polyimide Multilayer Substrate
*Hideyuki Fujinami, Shoji Ito, Hiroshi Kutami, Osamu Nakao, Nobuyuki Sadakata
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Keywords: the Polyimide Multilayer Substrate, Reliability Evaluation
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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