Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 14A-10
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Behavior of Junctional Boundary Between Electroless Au/Pd/Ni-P Plating and Solder Ball
*Kenji Takakura, Hirosi Murakami, Ken Sugiura
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Keywords: Electroless Au/Pd/Ni-P plating, P-enriched layer
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[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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