Proceedings of JIEP Annual Meeting
The 21th JIEP Annual Meeting
Session ID : 16A-12
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Thermal of BGA packaged circuit board measured by laser speckle interferometer-The effect of temperature and heat cycle.
*Tomohito Tsuji, Takashi Ohkoshi, Koji Koibuchi
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Keywords: heat cycle, laser speckle interferometer, BGA packaged circuit board, Heat transformation
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Abstract
[in Japanese]
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© 2007 by The Japan Institute of Electronics Packaging
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