Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-01
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Host: Japan Institute of Electronics Packaging

Viscoplastic Finite Element Simulation of Pb free solder with tensile and compressive loading
*Takeharu Hayashi, Yoshinori Ebihara, Tatsuhiko Asai, Hirihiko Watanabe
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Keywords: Pb free solder, Finite Element Simulation, viscoplastic, tensile and compressive loading
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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