Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-02
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Host: Japan Institute of Electronics Packaging

A Study on Reliability Design Support Method for Electronic Device BGA Package
*Keita Saji, Qiang Yu, Tadahiro Shibutani, Satoshi Kondou, Masaki Shiratori
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Keywords: Reliability, Electronic Device, BGA Package, FEM Analysis, thermal fatigue life
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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