Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-08
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Host: Japan Institute of Electronics Packaging

Reliability analysis of various VIA structures on Printed Circuit Board by Finite Element Method
*Masahisa Fujino, Tadatomo Suga
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Keywords: PCB, VIA, Reliability
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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