Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18B-07
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Host: Japan Institute of Electronics Packaging

Consideration on Thermal shock reliability of Plated via in Multi layers printed circuit board
*Yasushi Kihara
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Keywords: Multi layers printed circuit board, Plated via, Thermal shock reliability
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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