Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18C-13
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Host: Japan Institute of Electronics Packaging

Oxide removal of lead free solder by high density radical
*Satoru Kagata, Tsuyoshi Nakashima, Akira Izumi
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Keywords: lead free solder, oxide, radical
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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