Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 18C-14
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Host: Japan Institute of Electronics Packaging

Solder supply on Cu by a molten solder ejection method
*Yoshinori Yokoyama, Kazuyo Endo, Takashi Tokunaga, Hiroshi Fukumoto
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Keywords: Molten solder ejection method, Flux, Bump shear
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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